Our technical capabilities cover the full spectrum of rigid-flex PCB manufacturing. From 2-layer simple structures to 36-layer complex designs, we deliver HDI, any-layer interconnection and specialized processes tailored to each customer's requirements.
Layer Range
2 – 36 layers
Projects Delivered
Nearly 6,800
Manufacturing Capability Matrix
(Click image to view full size)
Core Capabilities
01
HDI Technology
02
Any-Layer Interconnection
03
Resin Via Filling
04
Precise Impedance Control
05
Overlapping Flexible Zones
06
Unequal-Thickness Structures
07
Hollow-Out Design
08