Dongguan Rigid Flex Circuit Co., Ltd. is a professional manufacturer focused on the research, process optimization and customized production of high-quality rigid-flex PCBs.
Equipped with a full set of modern production and precision testing equipment and a complete industrial chain, our factory independently completes the whole manufacturing process, from base material processing and precision fabrication to finished product inspection, ensuring stable capacity and mature craftsmanship.
Backed by an experienced engineering team, we have successfully delivered nearly 6,800 rigid-flex PCB projects, covering rapid prototyping, small-batch trial production and mass production. With rich experience in complex PCB manufacturing, we respond quickly to personalized customization requirements and solve difficult production problems caused by special structures and high-precision processes.
We provide customized rigid-flex PCB solutions ranging from 2 to 36 layers. Our core capabilities include HDI technology, any-layer interconnection, resin via filling, precise impedance control, overlapping flexible zones, unequal-thickness structures, hollow-out design and gold finger processing. Full technical parameters and process specifications are displayed in our Technical Capabilities page.
For strict quality assurance, our workshop is equipped with professional metallographic slicing inspection equipment to verify stack-up structure, lamination quality, dimensional accuracy and structural stability for every production batch. We implement standardized full-process quality control, including incoming material inspection, pre-production DFM evaluation, prototype confirmation and final delivery inspection. All products fully comply with international industrial standards.
Our rigid-flex boards are widely applied in precision industrial control, high-end medical diagnostic equipment, communication base stations and radio frequency devices, serving customers worldwide. Beyond PCB production, we provide one-stop supporting services including stack-up design, DFM manufacturability evaluation, process optimization and full-cycle technical after-sales support.